Semiconductor package structure and method for manufacturing the same

A semiconductor package structure, comprising:

• a lower conductive structure;
• an upper conductive structure disposed on the lower conductive structure;
• a first semiconductor device;
• a second semiconductor device electrically connected to the first semiconductor device by a first path in the upper conductive structure;
• and
• an interconnection structure,
• wherein the lower conductive structure is electrically connected to the first semiconductor device through a second path in the upper conductive structure under the first path,
• the first path comprises a plurality of first traces extending across a gap between the first semiconductor device and the second semiconductor device and electrically connecting the first semiconductor device to the second semiconductor device, wherein the outmost of the first traces define a bridge region,
• the interconnection structure is disposed under the bridge region and disposed between and electrically connecting the upper conductive structure and the lower conductive structure,
• the interconnection structure is made of a metal pillar connected to a first pad of the lower conductive structure, and wherein there is at least one void between the interconnection structure and the first pad of the lower conductive structure.