Semiconductor device
AssigneeSK hynix Inc.
InventorsNam-Hea Jang, Young-Hoon Kim
Life of this patent
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Abstract
A semiconductor device includes a substrate provided with a decoupling capacitor and plurality of circuit elements disposed along a first direction, and a plurality of first wiring line patterns disposed in a first wiring line layer over the substrate, including a power routing pattern coupled to the decoupling capacitor and a plurality of internal wiring line patterns coupled to the plurality of circuit elements. The plurality of first wiring line patterns extend in the first direction, and are aligned in conformity with virtual wiring line pattern tracks which are defined at a first pitch along a second direction intersecting the first direction and parallel to the substrate.
Claims20
A semiconductor device comprising:
- a substrate provided with a decoupling capacitor and plurality of circuit elements disposed along a first direction;
- and
- a plurality of first wiring line patterns disposed in a first wiring line layer over the substrate, including a power routing pattern coupled to the decoupling capacitor and a plurality of internal wiring line patterns coupled to the plurality of circuit elements,
- wherein the plurality of first wiring line patterns extend in the first direction, and are aligned in conformity with virtual wiring line pattern tracks which are defined at a first pitch along a second direction intersecting the first direction and parallel to the substrate.
A semiconductor device comprising:
- a memory structure;
- and
- a logic structure bonded to the memory structure,
- the logic structure comprising
- a substrate provided with a decoupling capacitor and a plurality of transistors disposed along a first direction;
- and
- a plurality of first wiring line patterns disposed in a first wiring line layer over the substrate, including a plurality of internal wiring line patterns coupled to the plurality of transistors and a power routing pattern coupled to the decoupling capacitor,
- wherein the plurality of first wiring line patterns extend in the first direction and are aligned in conformity with virtual wiring line pattern tracks which are defined at a first pitch along a second direction intersected with the first direction and parallel to the substrate.
Dependencies are inferred from the claim text.