Contact area structure with organic adhesive layer between inorganic conductive layer and transparent conductive layer

A contact area structure, comprising:

• an organic substrate comprising at least one contact pad area, the at least one contact pad area comprising a first block and a second block adjacent to the first block;
• an inorganic conductive layer disposed on the organic substrate, wherein the inorganic conductive layer is partially disposed on the first block, and a portion of an upper surface of the organic substrate is exposed at the second block;
• an organic adhesive layer covering the inorganic conductive layer and the upper surface of the organic substrate;
• and
• a transparent conductive layer disposed on the organic adhesive layer, wherein the inorganic conductive layer and the transparent conductive layer have different material compositions, the transparent conductive layer comprises a first portion and a second portion, the inorganic conductive layer defines a structure extending between the first portion and the second portion, and a first end of the structure underlies the first portion and a second end of the structure underlies the second portion.