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US 11,538,745 B2Granted
Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorKazuki Takakura
Life of this patent
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Abstract
A semiconductor device includes at least one member that is partially sealed by a sealing material and has a part of thereof being exposed from the sealing material, a reversible temperature indicating material, and an irreversible temperature indicating material. Each of the reversible temperature indicating material and the irreversible temperature indicating material is provided on a surface of any one of the at least one member.
Claims20
A semiconductor device comprising:
- at least one semiconductor chip;
- a sealing material integrally sealing the at least one semiconductor chip;
- at least one member, each being partially sealed by the sealing material and having a part being exposed from the sealing material;
- a reversible temperature indicating material;
- and
- an irreversible temperature indicating material, wherein
- each of the reversible temperature indicating material and the irreversible temperature indicating material is provided on a surface of any one of the at least one member.
4 more elements
Dependencies are inferred from the claim text.