Packaged multichip module with conductive connectors

A semiconductor package, comprising:

• a the substrate having half-etched patterned conductive material layer and including a device mounting surface and an opposing surface, the substrate including a first layer of conductive material including a first thickness, and a second layer of the conductive material including a second thickness;
• a first semiconductor device mounted to a first area of the device mounting surface;
• a second semiconductor device mounted to a second area on the device mounting surface and spaced from the first semiconductor device;
• at least two connectors formed of the first layer of conductive material of the substrate, and partially between the first semiconductor device and the second semiconductor device;
• wherein the substrate is a lead frame;
• and
• a third connector formed of the first layer and the second layer, the third connector electrically connected to more than two bond pads of the second semiconductor device, the second layer exposed from the semiconductor package.

A package, comprising:

• a portion of a lead frame having half-etched patterned portions and including first and second layers, a first device mounting area on a first surface of the first layer, a second device mounting area on the first surface, and connectors formed in the first layer between the first device mounting area and the second device mounting area formed in the first layer, and an opposing second surface formed in the second layer;
• a first semiconductor device flip chip connected to the first device mounting area on the first surface;
• a second semiconductor device flip chip connected to the second device mounting area on the first surface and spaced from the first semiconductor device;
• at least two of the connectors coupled between the first semiconductor device and the second semiconductor device;
• a third connector formed in the first layer and the second layer, wherein the third connector electrically and mechanically connects to at least two bond pads of the second semiconductor device;
• and
• mold compound covering the at least two connectors, the first semiconductor device, the second semiconductor device, and the lead frame, wherein the at least two connectors include a rectangular cross-sectional shape.