Multi-chip module leadless package

A method of assembling a multi-chip module (MCM) package, comprising:

• providing a leadless leadframe including a plurality of lead terminals including a plurality of half-etched lead terminals that include a full-thickness portion and a distally located half-etched portion and second lead terminals including at least one thermal pad;
• attaching a first die with a dielectric die attach material to the plurality of half-etched lead terminals, the first die comprising first bond pads coupled to first circuitry including circuit elements configured for receiving a control signal and for outputting a coded signal at a selected frequency, and a transmitter;
• attaching at least a second die using a conductive die attach material to the thermal pad, the second die comprising second bond pads coupled to second circuitry including circuit elements configured for a receiver with a gate driver;
• wherein there is at least one high-voltage isolation device on the first die or on the second die between the transmitter and the receiver;
• positioning bond wires including die-to-die bond wires between a portion of the first bond pads and a portion of the second bond pads, and
• forming a mold compound for encapsulating the first die and the second die.

A telecom module, comprising:

• a DC/DC power converter having a converter input side configured for receiving a DC voltage that is applied to an input of a high-voltage isolation device that provides a DC output voltage to a converter output side,
• at least one multi-chip module (MCM) package, comprising:
• a leadless leadframe including a plurality of lead terminals including on an input side a plurality of half-etched lead terminals that include a full-thickness portion and a distally located half-etched portion, and on an output side second lead terminals including at least one thermal pad having a pad area;
• a first die attached by a dielectric die attach material to the plurality of half-etched lead terminals, the first die comprising first bond pads coupled to first circuitry including circuit elements configured as a first receiver for receiving a first control signal and for outputting a coded signal at a selected frequency, and a first transmitter, wherein there is a first on-chip high-voltage isolation device between the first receiver and the first transmitter;
• at least one second die attached to the second lead terminals including the thermal pad, the second die comprising second bond pads coupled to second circuitry including circuit elements configured as a second receiver for a receiver for receiving a second control signal, the receiver with a gate driver, wherein there is a second on-chip high-voltage isolation device between the second receiver and the second transmitter, wherein the second die is attached by a conductive die attach material to the thermal pad, and wherein an area of the second die is within the pad area;
• bond wires including bond wires between the first bond pads and the half-etched lead terminals, bond wires between the second bond pads and the second lead terminals, and die-to-die bond wires between the first bond pads and the second bond pads;
• and
• a mold compound for encapsulating the first die and the second die;
• a controller coupled to the converter input side and to the converter output side, wherein the controller is configured to:
• sense a voltage level at an output of the converter output side, and
• transmit an AC control signal to the converter output side that is transmitted across the high-voltage isolation device to the converter input side to control a voltage applied to gates of transistors of the converter input side to achieve a desired voltage regulation and a higher power conversion efficiency.