Leads for semiconductor package
AssigneeTexas Instruments Incorporated
InventorsJason Chien, Yuh-Harng Chien, J K Ho
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a first lead with first and second ends extending in the same direction as one another. At least one second lead has first and second ends and is partially surrounded by the first lead. A die pad is provided and a die is connected to the die pad. Wires electrically connect the die to the first lead and the at least one second lead. An insulating layer extends over the leads, the die pad, and the die such that the first end of the at least one second lead is exposed from the semiconductor package and the second end of the first lead is encapsulated entirely within the insulating layer.
Claims8
A semiconductor package comprising:
- a first lead having first and second ends extending in the same direction as one another;
- at least one second lead each having first and second ends and being partially surrounded by the first lead;
- a first die pad;
- a first die connected to the first die pad and electrically connected to the first and second leads, the first die configured to transmit an isolation voltage at a first level;
- a third lead having first and second ends extending in the same direction as one another;
- at least one fourth lead each having first and second ends and being partially surrounded by the third lead;
- a second die pad;
- a second die connected to the second die pad and electrically connected to the third and fourth leads, the second die configured to transmit power at a second level greater than the first level;
- and
- an insulating layer extending over the leads, the die pads, and the dies such that the first ends of the second lead and the fourth lead are exposed and the second end of the first lead and the third lead are encapsulated entirely within the insulating layer.
Dependencies are inferred from the claim text.