Cooling apparatus, semiconductor module, and vehicle
AssigneeFuji Electric Co., Ltd.
InventorNobuhide Arai
Life of this patent
Estimating the term…
Abstract
A semiconductor module including a cooling apparatus and a semiconductor device mounted on the cooling apparatus is provided. The cooling apparatus includes a cooling fin arranged below the semiconductor device, a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin, a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel, and a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction.
Claims23
A semiconductor module comprising:
- a cooling apparatus;
- and
- a semiconductor device mounted on the cooling apparatus, wherein
- the cooling apparatus includes:
- a cooling fin arranged below the semiconductor device;
- a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin;
- a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel;
- and
- a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction;
- wherein the first inclined portion includes a first pair of sidewalls and a first bottom portion together defining a first U-shaped channel.
A semiconductor module comprising:
- a cooling apparatus;
- and
- a semiconductor device mounted on the cooling apparatus, wherein
- the cooling apparatus includes:
- a cooling fin arranged below the semiconductor device;
- a main-body portion flow channel through which a coolant flows in a predetermined direction to cool the cooling fin;
- a first coolant flow channel that is connected to one side of the main-body portion flow channel and has a first inclined portion upwardly inclined toward the main-body portion flow channel;
- and
- a conveying channel that, when seen from above, lets the coolant into the first coolant flow channel from a direction perpendicular to the predetermined direction or lets the coolant out of the first coolant flow channel in the direction perpendicular to the predetermined direction;
- wherein
- the first inclined portion includes a first pair of sidewalls and a first bottom portion together defining a first U-shaped channel, and
- when seen from above, the first inclined portion overlaps with at least a part of the cooling fin.
Dependencies are inferred from the claim text.