Method of forming integrated circuit packages with mechanical braces

A method comprising:

• forming a package component comprising an integrated circuit die, a redistribution structure over the integrated circuit die, and a socket over the redistribution structure;
• attaching a mechanical brace to a first side of the package component so that the mechanical brace is physically coupled to edge regions of the socket, the mechanical brace comprising a rigid layer and a soft layer disposed between the rigid layer and the socket, the rigid layer having a first stiffness, the soft layer having a second stiffness, the second stiffness being less than the first stiffness;
• and
• attaching a thermal module to a second side of the package component so that the thermal module is thermally coupled to the integrated circuit die.

A method comprising:

• forming a package component comprising integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure;
• assembling the package component between a thermal module and a mechanical brace with bolts extending through the thermal module, the package component, and the mechanical brace, wherein the mechanical brace comprises a rigid layer and a soft layer disposed between the rigid layer and the sockets;
• and
• tightening fasteners on the bolts to increase force applied to the package component by the thermal module and the mechanical brace, the soft layer conforming to a shape of the sockets.