Method for forming board assembly with chemical vapor deposition diamond (CVDD) windows for thermal transport
AssigneeMicrochip Technology Caldicot Limited
InventorsPhilip Andrew Swire, Nina Biddle
Life of this patent
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Abstract
A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.
Claims16
A method for forming a board assembly comprising:
- identifying a location of a hot-spot on a semiconductor die;
- cutting an opening in a circuit board corresponding to the location of the identified hot-spot;
- inserting a Chemical Vapor Deposition Diamond (CVDD) window into the opening;
- applying a layer of thermally conductive paste over the CVDD window;
- and
- placing the semiconductor die over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot on the semiconductor die and a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.
A method for forming a board assembly comprising:
- identifying a location of a hot-spot on a semiconductor die;
- attaching a Chemical Vapor Deposition Diamond (CVDD) window onto a surface of a thermally conductive plate, in a location corresponding to the location of the hot-spot on the semiconductor die;
- applying a layer of thermally conductive paste over the attached CVDD window;
- attaching the semiconductor die to a circuit board such that the semiconductor die is electrically coupled to the circuit board;
- and
- placing the thermally conductive plate over the semiconductor die so that the layer of thermally conductive paste is in contact with the semiconductor die and the CVDD window overlies the hot-spot on the semiconductor device.
Dependencies are inferred from the claim text.