Thermal solutions for package on package (PoP) architectures

An electronic package, comprising:

• a first package substrate;
• a first die stack over the first package substrate;
• a heat spreader over the first die stack, wherein the heat spreader comprises arms that extend out past sidewalls of the first package substrate;
• an interposer over and around the heat spreader, wherein the interposer is electrically coupled to the first package substrate by a plurality of interconnects;
• a second package substrate over the interposer;
• a second die over the second package substrate;
• and
• a thermally conductive plate over the arms of the heat spreader, wherein the thermally conductive plate comprises an opening that surrounds the second die.

An electronic package, comprising:

• a first package substrate;
• a first die stack over the first package substrate;
• a heat spreader over the first die stack;
• a conductive adhesive over the heat spreader;
• and
• a second package substrate over the conductive adhesive, wherein a surface of the heat spreader is substantially coplanar with a surface of the second package substrate.

An electronic package, comprising:

• a first package substrate;
• a first die stack over the first package substrate;
• a heat spreader over the first die stack, wherein the heat spreader comprises arms that extend out past sidewalls of the first package substrate;
• a second package substrate over and around the heat spreader, wherein the second package substrate is electrically coupled to the first package substrate by a plurality of interconnects, wherein a surface of the second package substrate is substantially coplanar with a surface of the heat spreader;
• and
• a second die over the second package substrate.

An electronic package, comprising:

• a first package substrate;
• a first die stack over the first package substrate;
• a heat spreader over the first die stack, wherein the heat spreader comprises arms that extend out past sidewalls of the first package substrate;
• an interposer over and around the heat spreader, wherein the interposer is electrically coupled to the first package substrate by a plurality of interconnects;
• a second package substrate over the interposer;
• and
• a second die over the second package substrate;
• and
• a board, wherein the first package substrate is electrically coupled to the board, wherein the heat spreader further comprises legs extending down from the arms, wherein the legs are supported on the board.