Chip scale package structure of heat-dissipating type

A chip scale package structure of a heat-dissipating type, comprising:

• a board;
• a die fixed on and electrically coupled to the board, wherein the die has a heat-output surface arranged away from the board;
• a thermally conductive adhesive sheet, being a non-transparent and solid colloid having silicone and glass fibers, wherein the thermally conductive adhesive sheet is adhered to the heat-output surface of the die through an adhesive layer thereof and is connected to at least 50% of an area of the heat-output surface, and wherein the thermally conductive adhesive sheet has a heat-dissipating surface arranged away from the die and a surrounding lateral surface that is connected to a peripheral edge of the heat-dissipating surface;
• and
• a package body formed on the board, wherein the package body covers and is connected to the die and an entirety of the surrounding lateral surface of the thermally conductive adhesive sheet,
• wherein the die is encapsulated in the package body, and wherein the heat-dissipating surface of the thermally conductive adhesive sheet is coplanar and flush with a top side of the package body and is configured to be exposed to air, and a thermal conductivity of the thermally conductive adhesive sheet is at least 150% of a thermal conductivity of the package body,
• wherein the package body is connected to the entirety of the surrounding lateral surface of the thermally conductive adhesive sheet, and the surrounding lateral surface of the thermally conductive adhesive sheet is in an arced shape that has a center of curvature located in the thermally conductive adhesive sheet.