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US 11,538,727 B2Granted
Semiconductor module
AssigneeMitsubishi Electric Corporation
InventorHiroyuki Masumoto
Life of this patent
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Abstract
A semiconductor module includes: a case; a semiconductor chip provided inside the case; a seal material injected to inside of the case and sealing the semiconductor chip; and a lid provided inside the case and contacting an upper surface of the seal material, wherein a tapered portion is provided at an end portion of the lid on an upper surface side, a gap is provided between a side surface of the end portion of the lid and an inner side surface of the case, and the seal material crawls up to the tapered portion through the gap.
Claims10
A semiconductor module comprising:
- a case;
- a semiconductor chip provided inside the case;
- a seal material injected to inside of the case and sealing the semiconductor chip;
- and
- a lid provided inside the case and contacting an upper surface of the seal material, wherein
- a tapered portion is provided to extend from an outermost end of the lid on an upper surface side,
- a gap is provided between a side surface of the outermost end portion of the lid and an inner side surface of the case,
- the seal material crawls up to the tapered portion through the gap, and
- a width of the gap from the outermost end portion to the inner side surface is equal to or less than 2 mm.
6 more elements
Dependencies are inferred from the claim text.