Processing method of workpiece with laser power adjustment based on thickness measurement and processing apparatus thereof

A processing method of processing a wafer as a workpiece, the processing method comprising:

• a disposing step of disposing the workpiece in a liquid containing a substance that generates an active species that reacts with the workpiece;
• a measurement step of measuring distribution of thickness of the workpiece disposed in the liquid;
• and
• a laser beam irradiation step of irradiating the workpiece in the liquid with a laser beam of which power is adjusted based on the distribution of the thickness measured in the measurement step, wherein
• in the laser beam irradiation step, a removal amount, by which a region irradiated with the laser beam in the workpiece is removed by the active species, is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.

A processing method of processing a wafer as a workpiece, the processing method comprising:

• a disposing step of disposing the workpiece in a liquid containing an active species that reacts with the workpiece;
• a measurement step of measuring distribution of thickness of the workpiece disposed in the liquid;
• and
• a laser beam irradiation step of irradiating the workpiece in the liquid with a laser beam of which power is adjusted based on the distribution of the thickness measured in the measurement step, wherein
• in the laser beam irradiation step, a removal amount, by which a region irradiated with the laser beam in the workpiece is removed by the active species, is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.

A processing apparatus for processing a wafer as a workpiece, the processing apparatus comprising:

• a supply unit that supplies, to the workpiece, a gas containing a substance that generates an active species that reacts with the workpiece, a liquid containing a substance that generates an active species that reacts with the workpiece, or a liquid containing an active species that reacts with the workpiece;
• a measuring unit used when distribution of thickness of the workpiece is measured;
• a laser beam irradiation unit having an adjuster that adjusts power of a laser beam;
• a control unit that controls the adjuster based on the distribution of the thickness of the workpiece measured by using the measuring unit;
• and
• a circulation unit for circulating the gas or liquid along an annular flow path;
• a separation unit for separating and removing an unnecessary substance generated due to the processing of the workpiece from the gas or liquid circulated in the annular flow path.