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US 11,538,717 B2Granted
Electronic package for integrated circuits and related methods
AssigneeTexas Instruments Incorporated
InventorsKurt Peter Wachtler, Anindya Poddar, Usman Mahmood Chaudhry
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Abstract
Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.
Claims14
An electronic package comprising:
- a substrate;
- a first die electrically connected to the substrate;
- a bulk acoustic wave (BAW) device attached to, and electrically connected to, the first die;
- a protective material covering portions of a top surface of the first die, a top surface of the BAW device, and covering an entire area of a bottom surface of the first die, the bottom surface proximate to the substrate than the top surface;
- a cavity filled with air covering portions of the protective material;
- and
- an enclosure covering portions of the cavity.
4 more elements
Dependencies are inferred from the claim text.