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US 11,538,711 B2Granted
Methods for edge trimming of semiconductor wafers and related apparatus
AssigneeMicron Technology, Inc.
InventorJing-Cheng Lin
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.
Claims22
A method, comprising:
- forming modified zones in material of at least a partial thickness of a semiconductor wafer inwardly of and adjacent to a peripheral edge thereof;
- and
- contacting the semiconductor wafer between the modified zones and the peripheral edge of the semiconductor wafer with a blade to remove material of the semiconductor wafer to substantially the at least a partial thickness.
A method, comprising:
- forming a trench in semiconductor material of a wafer inwardly of and adjacent to a peripheral edge thereof;
- and
- contacting the wafer between the trench and the peripheral edge of the wafer with a blade to remove semiconductor material to substantially a depth of the trench.
An apparatus, comprising:
- a stage configured to receive one of a device wafer or a carrier wafer having a device wafer mounted thereon;
- a laser tool located above the stage and oriented to direct a laser beam downwardly toward the stage, the laser tool configured for generating a laser beam and adjusting a focal point of the laser beam vertically;
- wherein at least one of the stage is rotatable about a vertical axis or the laser tool is programmable to direct the laser beam in a path radially inwardly of a peripheral edge of a device wafer supported by the stage;
- another stage configured to receive the one of a device wafer or a carrier wafer having a device wafer mounted thereon and rotatable about a vertical axis;
- and
- a vertically movable blade rotatable about a horizontal axis along a radius from the vertical axis of the another stage and positionable over the device wafer or the device wafer mounted on the carrier wafer received on the another stage proximate to and radially inward of an outer periphery thereof.
3 more elements
Dependencies are inferred from the claim text.