Carrier plate removing method

A carrier plate removing method for removing a carrier plate from a workpiece having a plurality of device chips, and being disposed on a top surface of the carrier plate via a provisional bonding layer, the carrier plate removing method comprising:

• a stepped portion forming step of forming a stepped portion in which a peripheral side portion of the workpiece projects sideward beyond a peripheral side portion of the carrier plate by removing a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate and a part of the provisional bonding layer along the peripheral edge in a depth direction of the provisional bonding layer without cutting entirely through the provisional bonding layer;
• a carrier plate holding step of holding the carrier plate by a carrier plate holding unit after performing the stepped portion forming step;
• and
• a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separation from the carrier plate after performing the stepped portion forming step.