Method of inspecting a semiconductor processing chamber using a vision sensor, and method for manufacturing a semiconductor device using the same

A method for manufacturing a semiconductor device, the method comprising:

• providing a semiconductor substrate in a semiconductor processing chamber;
• performing a process for manufacturing the semiconductor device on the semiconductor substrate in the semiconductor processing chamber;
• transferring the semiconductor substrate out of the semiconductor processing chamber;
• and
• inspecting an internal structure of the semiconductor processing chamber by providing a vision sensor into the semiconductor processing chamber,
• wherein the inspecting of the internal structure of the semiconductor processing chamber includes:
• obtaining an object image of a target using an image scanning module of the vision sensor;
• and
• generating a three dimensional model of the target based on the object image;
• and wherein the obtaining of the object image of the target includes:
• projecting a pattern onto the target using an illuminator of the image scanning module;
• and
• scanning an image of the target in which the pattern is projected, using a camera of the image scanning module,
• wherein the generating of the three dimensional model is based on a distance between a first segment of the pattern captured from the target by the camera and a second segment of the pattern captured from the target by the camera,
• wherein a height component for the three dimensional model is based on the following equation:
• h=d/(tan θ),
• where d is the distance between the first segment of the pattern and the second segment of the pattern, and θ is an angle at which a laser light projects the pattern onto a surface of the target.