Method and apparatus for embedding semiconductor devices

A method for transferring a semiconductor die, comprising:

• providing a semiconductor die having at least a first surface forming a bottom of the semiconductor die, a second surface, the second surface adjoined to the first surface forming a sidewall of the semiconductor die and extending in a direction transverse to the first surface, and a third surface opposite the first surface and adjoined to the second surface, the third surface forming a top of the semiconductor die;
• providing a product substrate including a transfer location on a transfer surface of the product substrate, the transfer location including at least one depression;
• positioning the semiconductor die to be transferred with the transfer location on the transfer surface of the product substrate;
• and
• transferring the semiconductor die onto the transfer location on the transfer surface of the product substrate, wherein transferring the semiconductor die includes aligning the semiconductor die within the at least one depression, and the transferring:
• displacing at least a portion of material of the product substrate, at least partially during the transferring, so as to create a ripple around the semiconductor die, the ripple including an apex and a trough,
• wherein:
• the apex is a point on the ripple on a first plane, and
• the trough is a point on the ripple on a second plane that is substantially parallel with the first plane, and
• causing the first surface to be disposed at least partially in contact with the trough and the third surface to be disposed at or below the first plane.

An apparatus having a semiconductor die thereon, the apparatus formed by a method comprising:

• positioning the semiconductor die to be transferred onto a product substrate including a transfer location on a transfer surface, the semiconductor die being an unpackaged LED and including at least:
• a first surface forming a bottom of the semiconductor die,
• a second surface extending in a direction transverse to the first surface, the second surface forming a sidewall of the semiconductor die, and
• a third surface that is opposite the first surface and adjoined to the second surface, the third surface forming a top of the semiconductor die;
• and
• transferring the semiconductor die onto the transfer location on the transfer surface of the product substrate, wherein the transferring:
• displaces at least a portion of material of the product substrate creating a ripple on the product substrate wherein the ripple includes an apex forming a top point of the ripple and a trough defining a bottom point of the ripple, and
• disposes the first surface at least partially in contact with the trough and the third surface at or below the apex of the ripple.