Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures

A cleave system for cleaving a semiconductor structure having a top surface and a bottom surface generally parallel to the top surface, the cleave system comprising:

• a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure;
• a suction member for grasping the semiconductor structure on the top surface of the semiconductor structure;
• a suction rod that extends through the cleave arm, the suction rod being connected to the suction member toward a first end of the suction rod;
• a spring member that applies a cleave force to the semiconductor structure when the cleave arm is in the raised position, the suction rod extending through the spring member;
• and
• a collar that extends radially outward from the suction rod, the spring member being disposed between the collar and the cleave arm, the spring member being compressed when the cleave arm is in the raised position, the collar being part of a collar clamp that is adjustable along a longitudinal axis of the suction rod to change the compression of the spring member.