Manufacturing a module with solder body having elevated edge
AssigneeInfineon Technologies AG
InventorsAchim Muecke, Arthur Unrau
Life of this patent
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Abstract
A method of manufacturing a module is disclosed. In one example, the method comprises providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion. At least one carrier, on which at least one electronic component is mounted, is placed in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge.
Claims10
A method of manufacturing a module, wherein the method comprises:
- providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion;
- placing at least one carrier, on which at least one electronic component is mounted, in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge;
- providing a plurality of solder bodies each with a base portion and an elevated edge extending along at least part of a circumference of the respective base portion;
- and
- placing each of a plurality of carriers, wherein at least one electronic component is mounted on each of the carriers, in an assigned one of the solder bodies so that each of the carriers is positioned on a respective base portion and is spatially confined by a respective elevated edge.
A method of manufacturing a module, wherein the method comprises:
- providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion;
- placing at least one carrier, on which at least one electronic component is mounted, in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge;
- wherein the method comprises placing the at least one solder body on a support body;
- and
- the support body with at least one solderable portion, into which material of the at least one solder body will flow during soldering, and at least one non-solderable portion, into which material of the at least one solder body will not flow during soldering.
A method of manufacturing a module, wherein the method comprises:
- providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion;
- placing at least one carrier, on which at least one electronic component is mounted, in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge;
- wherein the method comprises placing the at least one solder body on a support body;
- and
- forming a solder connection by the at least one solder body, provisionally attaching the at least one solder body to the support body, in particular in such a manner that a lateral sliding of the at least one solder body relative to the support body is disabled by the provisional attachment.
Dependencies are inferred from the claim text.