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US 11,538,693 B2Granted
Substrate processing method and substrate processing system
AssigneeTokyo Electron Limited
InventorRyuichi Asako
Life of this patent
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Abstract
A substrate processing method is provided. In the method, a substrate is provided. A monomer that is chemically bonded to the substrate is supplied onto the substrate. An initiator for polymerizing the monomer is supplied to the substrate having the supplied monomer thereon, thereby forming a polymer film.
Claims17
A substrate processing method, comprising:
- (a) providing a substrate having a first region containing silicon nitride and a second region containing silicon oxide;
- (b) supplying a monomer that is selectively and chemically bonded to the first region of the substrates;
- (c) supplying an initiator for polymerizing the monomer to the substrate having the supplied monomer thereon, thereby forming a polymer film;
- and
- (d) etching the second region while protecting the first region by the polymer film.
2 more elements
A substrate processing method, comprising:
- (a) providing a substrate including:
- a wafer;
- a raised region formed to be raised from the wafer and forming a recess that is defined by the raised region;
- a first region disposed on a surface of the raised region;
- and
- a second region disposed so as to fill the recess, said first region containing silicon nitride and the second region containing silicon oxide;
- (b) etching the second region until the first region is exposed;
- (c) supplying a monomer that is selectively and chemically bonded to the first region of the substrate;
- (d) supplying an initiator for polymerizing the monomer to the substrate having the supplied monomer thereon, thereby forming a polymer film;
- and
- (e) etching the second region while protecting the first region by the polymer film.
8 more elements
A substrate processing method, comprising:
- (a) providing a substrate having a first region containing silicon or metal and a second region that differs in composition from a composition of the first region;
- (b) supplying a monomer that is chemically bonded to the first region of the substrate;
- (c) supplying an initiator for polymerizing the monomer to the substrate having the supplied monomer thereon, thereby forming a polymer film;
- and
- (d) etching the second region while protecting the first region by the polymer film.
2 more elements
Dependencies are inferred from the claim text.