UV-assisted stripping of hardened photoresist to create chemical templates for directed self-assembly

A method for removing a first organic layer from a substrate comprising:

• depositing the first organic layer on a layer of photoresist different from the first organic layer such that the first organic layer and the layer of photoresist interface with each other and are distinguishable from each other;
• removing a first portion of the first organic layer by exposing the first organic layer to ultraviolet light and oxygen, the first portion of the first organic layer being a thickness across an entire surface of the first organic layer, wherein following removing the first portion, a second portion of the first organic layer remains on the layer of photoresist;
• and
• removing the second portion of the first organic layer using a wet chemical process without removing the layer of photoresist, and
• wherein the first portion comprises at least 40% of the thickness of the first organic layer and the second portion comprises a remainder of the thickness of the first organic layer.