Substrate processing method and substrate processing apparatus

#This application is a national phase of PCT application No. PCT/JP2017/032555, filed on 8 Sep. 2017, which claims priority from Japanese Patent Application No. 2016-184404, filed on 21 Sep. 2016, all of which are incorporated herein by reference.

#An embodiment disclosed herein relates to a substrate processing method and a substrate processing apparatus.

#Conventionally, in a semiconductor device manufacturing process, a liquid processing is performed on a substrate by supplying a processing liquid to a substrate such as, for example, a semiconductor wafer (see, e.g., Patent Document 1).

#FIG. 1 is a view illustrating a schematic configuration of a substrate processing system according to an embodiment.

#FIG. 2 is a view illustrating a schematic configuration of a processing unit.

#FIG. 3 is a view illustrating a schematic configuration of a post UV irradiation unit.

#Hereinafter, embodiments of a substrate processing method and a substrate processing apparatus disclosed herein will be described in detail with reference to the accompanying drawings. However, the present disclosure is not limited by the embodiments described below.

#FIG. 1 is a view illustrating a schematic configuration of a substrate processing system according to an embodiment. In the following description, in order to clarify a positional relationship, an X axis, a Y axis, and a Z axis which are orthogonal to each other are defined, and the Z-axis positive direction is defined as a vertical upward direction.

#As illustrated in FIG. 1, a substrate processing system 1 includes a carry-in/out station 2, and a processing station 3. The carry-in/out station 2 and the processing station 3 are provided adjacent to each other.