Sputtering target-backing plate assembly
AssigneeJX Nippon Mining & Metals Corporation
InventorsRyosuke Sakashita, Yosuke Endo, Naoki Ise, Hiroshi Takamura
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Abstract
A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 μm or more and 700 μm or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.
Claims5
A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer bonds the sputtering target to the backing plate and contains the brazing material and 5 vol % or more and 50 vol % or less of a material having thermal conductivity that is higher than that of the brazing material, a thickness of the braze bonding layer being 100 μm or more and 700 μm or less, and wherein the material having thermal conductivity that is higher than that of the brazing material consists of a metal powder having an average grain size (D50) of 1.0 μm or more and 100 μm or less.
Dependencies are inferred from the claim text.