Mounting stage, substrate processing device, and edge ring
AssigneeTokyo Electron Limited
InventorsYasuharu Sasaki, Kyo Tsuboi, Tomoya Kato, Shoichiro Matsuyama
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Abstract
Provided is a mounting stage on which a substrate to be subjected to a plasma process is mounted. The mounting stage includes: an electrostatic chuck configured to attract the substrate and an edge ring disposed around the substrate; and supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring. A groove is provided in at least one of the edge ring and the mounting stage, and the groove is not in communication with the supply holes.
Claims10
A mounting stage on which a substrate to be subjected to a plasma process is mounted, the mounting stage comprising:
- an electrostatic chuck configured to attract the substrate and an edge ring disposed around the substrate;
- and
- supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring,
- wherein a groove is provided in at least one of a rear surface of the edge ring and a surface of the mounting stage on which the edge ring is disposed,
- wherein the groove includes a plurality of grooves at locations corresponding to a circumference where the supply holes are arranged,
- wherein the plurality of grooves are not in communication with the supply holes wherein the plurality of grooves are intermittently arranged to have predetermined intervals along the circumference, and
- wherein each of the plurality of grooves and each of the supply holes are alternately arranged one by one along the circumference.
A substrate processing device comprising:
- a mounting stage on which a substrate is mounted;
- an edge ring disposed around the substrate;
- an electrostatic chuck configured to attract the edge ring and the substrate;
- and
- supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring,
- wherein a groove is provided in at least one of a rear surface of the edge ring and a surface of the mounting stage on which the edge ring is disposed,
- wherein the groove includes a plurality of grooves at locations corresponding to a circumference where the supply holes are arranged,
- wherein the plurality of grooves are not in communication with the supply holes wherein the plurality of grooves are arranged to have predetermined intervals along the circumference, and
- wherein each of the plurality of grooves and each of the supply holes are alternately arranged one by one along the circumference.
An edge ring disposed around a substrate to be subjected to a plasma process,
- wherein a groove is provided in a rear surface of the edge ring,
- wherein the groove is not in communication with supply holes through which a heat medium is supplied to a space between the edge ring and an electrostatic chuck configured to attract the edge ring,
- wherein the groove includes a plurality of grooves at locations corresponding to a circumference where the supply holes are arranged,
- wherein the plurality of grooves are arranged to have predetermined intervals along the circumference, and
- wherein each of the plurality of grooves and each of the supply holes are alternately arranged one by one along the circumference.
Dependencies are inferred from the claim text.