Co-axial grid array capacitor assembly

An electronic system comprising:

• a printed circuit board (PCB);
• an integrated circuit (IC) package;
• a grid array capacitor located between the IC package and the PCB, the grid array capacitor physically and electrically coupled to the IC package and to the PCB, the grid array capacitor comprising:
• an inner conductor physically and electrically connected to the IC package and to the PCB, wherein the inner conductor is a helical coil;
• an inner dielectric in a coaxial orientation to and at least partially surrounding the inner conductor;
• and
• a secondary conductor in a coaxial orientation to and at least partially surrounding the inner dielectric, the secondary conductor physically and electrically connected to the IC package and to the PCB.

A grid array capacitor located between an integrated circuit (IC) package and a printed circuit board (PCB), the grid array capacitor configured to be physically and electrically coupled to the IC package and to the PCB, the grid array capacitor comprising:

• an inner conductor configured to be electrically connected to the IC package and to the PCB;
• an inner dielectric in a coaxial orientation to and at least partially surrounding the inner conductor;
• and
• a secondary conductor in a coaxial orientation to and at least partially surrounding the inner dielectric, the secondary conductor configured to be electrically connected to the IC package and to the PCB;
• wherein the secondary conductor includes a first section adjacent to a first end and a second section adjacent to a second end, wherein the first section and the second section are spaced and electrically insulated from each other in a longitudinal direction of the coaxial orientation.