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US 11,538,633 B2Granted
Combination stiffener and capacitor
AssigneeIntel Corporation
InventorsEng Huat Goh, Jiun Hann Sir, Min Suet Lim
Life of this patent
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Abstract
Electronic device package stiffener and capacitor technology is disclosed. A combination stiffener and capacitor can include a structural material configured to be coupled to a substrate. The structural material can have a shape configured to provide mechanical support for the substrate. The combination stiffener and capacitor can also include first and second electrodes forming a capacitor. An electronic device package and a package substrate configured to receive the combination stiffener and capacitor are also disclosed.
Claims17
An electronic device package, comprising:
- a substrate having a lateral width;
- a first electronic component and a second electronic component coupled to the substrate;
- and
- a combination stiffener and capacitor coupled to the substrate, the combination stiffener and capacitor having a lateral width less than the lateral width of the substrate, and the combination stiffener and capacitor having sides and a lid, the lid extending between the sides and over the first electronic component and the second electronic component, and the combination stiffener and capacitor comprising a plurality of capacitor blocks, the combination stiffener and capacitor comprising a structural material coupled to the substrate and having a shape configured to provide mechanical support for the substrate, and each of the plurality of capacitor blocks of the combination stiffener and capacitor comprising first and second electrodes forming a capacitor, wherein the first electronic component and a first one of the plurality of capacitor blocks are in electrical communication, and wherein the second electronic component and a second one of the plurality of capacitor blocks are in electrical communication.
1 more element
Dependencies are inferred from the claim text.