Coil electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHyung Jin Jeon, Soon Kwang Kwon
Life of this patent
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Abstract
A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.
Claims14
A coil electronic component, comprising:
- a support substrate;
- a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern;
- at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region;
- an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate;
- and
- an external electrode disposed outside of the encapsulant and connected to the coil pattern,
- wherein the encapsulant encapsulates the at least one metal thin plate in its entirety.
A coil electronic component, comprising:
- a support substrate;
- a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern;
- a plurality of metal thin plates disposed in an upper portion of the coil pattern;
- an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the plurality of metal thin plates, and filled with a plurality of magnetic particles;
- and
- an external electrode disposed outside of the encapsulant and connected to the coil pattern,
- wherein at least a portion of the plurality of magnetic particles is disposed between the plurality of metal thin plates, and
- wherein the encapsulant encapsulates each of the plurality of metal thin plates in its entirety.
Dependencies are inferred from the claim text.