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US 11,538,617 B2Granted
Integrated magnetic core inductors on glass core substrates
AssigneeIntel Corporation
InventorsKrishna Bharath, Adel Elsherbini
Life of this patent
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Abstract
A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.
Claims18
An integrated circuit (IC) die package, comprising:
- a package core comprising glass with one or more conductive vias extending from a first side of the core to a second side of the core, opposite the first side;
- a first inductor structure over the first side of the package core and a second inductor structure over the second side of the package core, wherein each of the first and second inductor structures comprises:
- a conductive trace over the package core;
- a dielectric over the conductive trace, wherein the dielectric has a convex curved surface that spans at least a width of the conductive trace;
- and
- a magnetic cladding comprising a stack of films over the convex curved surface of the dielectric and at least partially surrounding the conductive trace, wherein a thickness of the dielectric between the magnetic cladding and the conductive trace varies from a center to an outer edge of the inductor structure as a function of the convex curved surface;
- and
- a top-level conductive structure over at least one of the first or second inductor structures;
- where the top-level conductive structure is to interconnect the conductive trace with an IC die.
6 more elements
A system, comprising:
- an integrated circuit (IC) die package, comprising:
- a package core comprising glass with one or more conductive vias extending from a first side of the core to a second side of the core, opposite the first side;
- an IC die over the first side of the package core;
- a first inductor over the first side of the package core and a second inductor over the second side of the package core, wherein each of the first and second inductors comprise:
- a conductive trace over the package core;
- a dielectric over the conductive trace, wherein the dielectric has a convex curved surface that spans a width of the conductive trace;
- and
- a magnetic core cladding comprising a stack of films over the convex curved surface of the dielectric and at least partially surrounding the conductive trace, wherein a thickness of the dielectric between the magnetic cladding and the conductive trace varies from a center to an outer edge of the inductor as a function of the convex curved surface;
- and
- wherein the IC die is coupled to at least one of the conductive traces through a top-level conductive structure between the IC die and the first inductor.
7 more elements
Dependencies are inferred from the claim text.