Information tamper-resistant system and method

#This is a Sect. 371 National Stage of PCT International Application No. PCT/CN2020/089728, filed on 12 May 2020, which claims priority of a Chinese Patent Application No. 2019113471886 filed on 24 Dec. 2019, the contents of which are incorporated herein by reference in its entirety.

#The present disclosure relates to the technical field of information security, in particular, to an information tamper-resistant system and method.

#With the rapid development of information technology, the secure transmission of information has received increasing attention. Once the information in the transmission process is stolen or tampered, the subsequent process cannot be carried out, and the immeasurable loss may be caused. In particular, in the chip manufacturing process, there is a hidden danger that the security information of the chip may be stolen and/or tampered at the stage from wafer taping, packaging, testing to using by end users, which seriously affects the availability of the chip.

#FIG. 1 shows a schematic view of an information tamper-resistant system according to an embodiment of the present disclosure.

#FIG. 2 shows a schematic view of the state of the information tamper-resistant system of the present disclosure during a writing operation.

#FIG. 3 shows a schematic view of the state of the information tamper-resistant system of the present disclosure during the first reading operation.

#1 Storage module 2 Writing module 3 First reading module 4 Second reading module 5 First OTP switch 6 Second OTP switch 7 Third OTP switch

#The embodiments of the present disclosure will be described below through exemplary embodiments. Those skilled in the art can easily understand other advantages and effects of the present disclosure according to contents disclosed by the specification. The present disclosure can also be implemented or applied through other different exemplary embodiments. Various modifications or changes can also be made to all details in the specification based on different points of view and applications without departing from the spirit of the present disclosure. It needs to be stated that the following embodiments and the features in the embodiments can be combined under the situation of no conflict.

#It needs to be stated that the drawings provided in the following embodiments are just used for schematically describing the basic concept of the present disclosure, thus only illustrating components only related to the present disclosure and are not drawn according to the numbers, shapes, and sizes of components during actual implementation, the configuration, number and scale of each component during the actual implementation thereof may be freely changed, and the component layout configuration thereof may be more complex.