Semiconductor device and semiconductor package including the semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsHyungjin Kim, Yongjun Kim, Yonghun Kim, Minsu Ahn, Reum Oh, Jinyong Choi
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AssigneeSamsung Electronics Co., Ltd.
InventorsHyungjin Kim, Yongjun Kim, Yonghun Kim, Minsu Ahn, Reum Oh, Jinyong Choi
Estimating the term…
A semiconductor device includes a cell area in which a plurality of memory cells are arranged in an array structure, and a peripheral area in which circuits configured to drive the memory cells are arranged, the peripheral area being next to the cell area. The cell area is divided into a plurality of banks, and the plurality of banks comprise first banks having a base size and second banks having a size of 1/(2*n) (wherein n is an integer greater than or equal to 1) of the base size. The plurality of banks are arranged in a first direction and a second direction perpendicular to the first direction, and the semiconductor device has a shape of a rectangular chip which is elongated in the second direction.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor package comprising:
Dependencies are inferred from the claim text.