Fingerprint sensor package and smartcard including the same

A fingerprint sensor package comprising:

• a package substrate in which a sensing region and a peripheral region surrounding the sensing region are defined, wherein each of corners of the package substrate has a round rectangular planar shape;
• and
• a controller chip mounted on the package substrate and configured to determine whether a recognized fingerprint corresponds to a registered fingerprint,
• wherein the package substrate comprises:
• a base layer;
• a coating member, an upper protection layer between the coating member and an upper surface of the base layer, and an upper insulating layer between the upper protection layer and the upper surface of the base layer;
• a molding member, a lower protection layer between the molding member and a lower surface of the base layer, and a lower insulating layer between the lower protection layer and the lower surface of the base layer;
• first conductive patterns, at least some of which are covered by the lower protection layer, the first conductive patterns including first ground patterns, power patterns, signal patterns, and first sensing pads,
• second conductive patterns covered by the lower insulating layer and including second ground patterns connected to the first ground patterns and second sensing pads connected to the first sensing pads;
• third conductive patterns covered by the upper insulating layer and including third ground patterns connected to the second ground patterns, first sensing patterns that are connected to some of the second sensing pads and are apart from each other in a first direction and extend in a second direction crossing the first direction, and third sensing pads connected to other ones of the second sensing pads;
• and
• fourth conductive patterns, at least some of which are covered by the upper protection layer, the fourth conductive patterns including fourth ground patterns connected to the third ground patterns and second sensing patterns that are connected to the third sensing pads and are apart from each other in the second direction and extend in the first direction,
• wherein the first and second sensing patterns are in the sensing region,
• wherein the controller chip is in the molding member, and
• wherein the fourth ground patterns are in the peripheral region and are apart from the coating member to surround the coating member in the first and second directions.

A smartcard comprising:

• a card main body having a groove area;
• a security chip storing financial information;
• and
• a fingerprint sensor package configured to sense a fingerprint of a user and transmit a signal regarding a sensing result to the security chip,
• wherein the fingerprint sensor package comprises:
• a package substrate having an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined and a lower surface facing the upper surface;
• a plurality of first sensing patterns that are in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction;
• a plurality of second sensing patterns that are in the sensing region, are apart from each other in the second direction, and extend in the first direction;
• a coating member covering the sensing region;
• an upper ground pattern that is in the peripheral region and apart from the coating member to surround the coating member in the first and second directions;
• and
• a plurality of capacitors, and
• wherein the plurality of first sensing patterns and the plurality of second sensing patterns are apart from each other in a third direction perpendicular to the first and second directions such that each capacitor from among the plurality of capacitors includes a sensing pattern from among the plurality of first sensing patterns as a first conductor and a sensing pattern from among the plurality of second sensing patterns as a second conductor.