Touch substrate and manufacturing method therefor, touch display substrate, and touch display device

A touch display substrate, comprising a touch substrate, the touch substrate, comprising:

• a touch structure, comprising a sensor pattern and a touch line, wherein the sensor pattern comprises a plurality of first sensor patterns and a plurality of second sensor patterns, the plurality of first sensor patterns are intersected with and insulated from the plurality of second sensor patterns, and the touch line comprises a plurality of first touch lines and a plurality of second touch lines, each of the plurality of first sensor patterns is connected with at least one of the first touch lines, and each of the plurality of second sensor patterns is connected with at least one of the second touch lines;
• a first ground line, located at a periphery of the touch structure;
• and
• at least one second ground line, located at a side of the first ground line facing away from the touch structure,
• the touch display substrate further comprises:
• a base substrate and an encapsulation film, wherein the touch structure, the first ground line, and the at least one second ground line are located at a side of the encapsulation film facing away from the base substrate;
• wherein the encapsulation film comprises a first film, a second film, and a third film, the second film is located between the first film and the third film, and the first film and the third film are in contact with each other at an edge to form a contacting part;
• and
• an orthographic projection of the at least one second ground line on the base substrate falls within an orthographic projection of the second film on the base substrate, or an orthographic projection of the at least one second ground line on the base substrate falls within an orthographic projection of the contacting part on the base substrate.

A manufacturing method of a touch substrate, comprising:

• forming a first conductive film on a base substrate;
• patterning the first conductive film to form a first pattern, wherein the first pattern comprises a bridge line, a first touch sub-line, a first ground sub-line, and a third ground sub-line;
• forming an insulating film;
• forming a first via hole, a second via hole, a third via hole, a fourth via hole, and a fifth via hole in the insulating film;
• forming a second conductive film;
• and
• patterning the second conductive film to form a second pattern, wherein the second pattern comprises a second touch sub-line, a second ground sub-line, a fourth ground sub-line, an integrally formed portion, and a main portion, the first ground sub-line and the second ground sub-line are connected through the first via hole to form a second ground line, the first touch sub-line and the second touch sub-line are connected through the second via hole to form a touch line, the third ground sub-line and the fourth ground sub-line are connected through the third via hole to form a first ground line, and adjacent main portions are connected with the bridge line through the fourth via hole and the fifth via hole, respectively.