Spin coater and semiconductor fabrication method for reducing regeneration of photoresist
AssigneeSamsung Electronics Co., Ltd.
InventorsMyung-Soo Hwang, Kwangsub Yoon
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Abstract
Systems and methods for semiconductor fabrication are described. A spin coater comprises a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing includes a lower housing including a solvent storage groove in which the organic solvent is stored, and an upper housing on the lower housing. The upper housing includes a nozzle insert hole on the solvent storage groove and receives the nozzle, and a gas supply hole connected to one side of the nozzle insert hole.
Claims11
A spin coater, comprising:
- a spin chuck that rotates a substrate;
- a nozzle that provides a photoresist on the substrate;
- a nozzle housing configured to receive the nozzle;
- a purge gas supply that supplies a purge gas into the nozzle housing;
- and
- a solvent supply that supplies a solvent into the nozzle housing;
- a purge gas exhauster that exhausts the purge gas from the nozzle housing;
- a photoresist supply that provides the photoresist into the nozzle;
- and
- a photoresist pipeline that connects the nozzle to the photoresist supply,
- wherein the nozzle housing includes:
- a lower housing including a solvent groove in which the solvent is stored;
- and
- an upper housing on the lower housing,
- wherein the upper housing includes:
- a nozzle insert hole above the solvent storage groove and configured to receive the nozzle;
- and
- a gas supply hole connected to one side of the nozzle insert hole,
- wherein the purge gas supply and the purge gas exhauster are connected to the photoresist pipeline,
- wherein the photoresist pipeline includes:
- an external line;
- and
- an internal line in the external line,
- wherein the purge gas supply provides the purge gas to a gap between an inner wall of the external line and an outer wall of the internal line,
- wherein the photoresist pipeline further includes a filler between the inner wall of the external line and the outer wall of the internal line, the filler with a pore through which the purge gas flows.
The spin coater 1, further comprising a first supply line that connects the purge gas supply to the photoresist pipeline,
- wherein the first supply line is connected to the external line and is separated from the internal line.
A spin coater, comprising:
- a spin chuck that rotates a substrate;
- a nozzle that provides a photoresist on the substrate;
- a photoresist supply that provides the nozzle with the photoresist;
- and
- a photoresist pipeline that connects the nozzle to the photoresist supply,
- wherein the photoresist pipeline includes:
- an external line;
- an internal line in the external line;
- and
- a filler between an inner wall of the external line and an outer wall of the internal line, the filler containing a purge gas.
Dependencies are inferred from the claim text.