Display device

A display device, comprising:

• a first substrate including a display area including pixels, a non-display area disposed around the display area, and a base substrate;
• and
• a second substrate facing the first substrate,
• wherein the first substrate includes a connection wiring connected to the pixels, disposed on the base substrate, and extending along a first direction, and a connection pad disposed on a side surface of the first substrate and a side surface of the second substrate, connected to the connection wiring, and extending along a thickness direction,
• the display device further includes a coupling member disposed on the side surface of the first substrate and the side surface of the second substrate,
• the coupling member includes a non-conductive film portion overlapping the connection wirings along the first direction, and a conductive film portion disposed around the non-conductive film portion,
• the conductive film portion includes a first base bonding layer and conductive balls dispersed in the first base bonding layer,
• the non-conductive film portion includes a second base bonding layer, and
• the second base bonding layer has higher viscosity than the first base bonding layer.

A display device, comprising:

• a first substrate including a display area having pixels, a non-display area disposed around the display area, a plurality of connection wirings connected to the pixels, extending along a first direction, and spaced apart from each other along a second direction intersecting the first direction, and a plurality of connection pads arranged on a side surface of the first substrate and a side surface of the second substrate, connected to the connection wirings, extending along a thickness direction, and spaced apart from each other along the second direction;
• a second substrate facing the first substrate;
• a coupling member including a non-conductive film portion overlapping the connection wirings along the first direction, and a conductive film portion disposed around at least one side of the non-conductive film portion;
• and
• a printed circuit board attached to side surfaces of the first substrate and the second substrate,
• wherein the coupling member is disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate,
• wherein the plurality of connection pads are directly connected to the plurality of connection wirings,
• wherein the conductive film portion includes a first base bonding layer and conductive balls dispersed in the first base bonding layer,
• wherein the non-conductive film portion includes a second base bonding layer, and
• wherein the second base bonding layer has higher viscosity than the first base bonding layer.