US 11,536,897 B1 · Multi-chip photonic quantum computer assembly with optical backplane interposer

Abstract

A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.

Claims20

Dependent claims

A device comprising:

an optical backplane including at least one optical waveguide layer;
and
a plurality of die stacks on the optical backplane, each die stack of the plurality of die stacks comprising:
a photonic integrated circuit (PIC) die including a photonic integrated circuit optically coupled to the at least one optical waveguide layer of the optical backplane;
and
an electronic integrated circuit (EIC) die bonded to the PIC die and including an electronic integrated circuit for controlling operations of the photonic integrated circuit of the PIC die,
wherein the at least one optical waveguide layer includes waveguides optically coupled to at least two die stacks of the plurality of die stacks and configured to transport, between the at least two die stacks of the plurality of die stacks, a photonic quantum system that includes a photon in one of two or more quantum modes.

4 more elements

Dependencies are inferred from the claim text.

Multi-chip photonic quantum computer assembly with optical backplane interposer

Life of this patent

Multi-chip photonic quantum computer assembly with optical backplane interposer

Life of this patent

Abstract

Claims20