Chip test method, apparatus, device, and system
AssigneeChangxin Memory Technologies, Inc.
InventorShu-Liang Ning
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AssigneeChangxin Memory Technologies, Inc.
InventorShu-Liang Ning
Estimating the term…
The present invention provides a chip test method, apparatus, device, and system. The chip test system may include: a test equipment, including n chip selection signal lines, m sets of first signal lines, and m*n sets of second signal lines; and m*n chip test sites, wherein each chip test site may be coupled to one of the n chip selection signal lines and one of the m sets of first signal lines, each of the m*n chip test sites may correspond to a unique combination of a chip selection signal line and a first signal line coupled thereto, and each chip test site may be correspondingly coupled to one of the m*n sets of second signal lines. According to an embodiment of the present invention, the limited pins of a test equipment may be used to implement individual control of multiple chips.
A chip test system, comprising:
A chip test method, configured for testing m*n chips at m*n chip test sites, the chip test method comprising:
A chip test apparatus, configured to test m*n chips at m*n chip test sites, the chip test apparatus comprising:
A chip test equipment, comprising:
A non-transitory computer readable storage medium storing a program, when being executed by a processor to cause the processor to perform operations including:
Dependencies are inferred from the claim text.
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Tester configuration: tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
Tester configuration: interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
Testing of digital circuits: hardware for routing the test signal within the device under test to the circuits to be tested, e.g. multiplexer for…
Measuring electric variables
About 12 years 11 months of term left · ends 20 Sep 2039 (estimated)
The present invention relates to the field of semiconductors technology, and in particular to an integrated circuit (IC) chip, an IC chip test method, apparatus, device, and system capable of individually testing multiple chips.
When multiple chips are tested in the related art, in order to implement individual test on each chip, it is usually required to provide an individual chip selection line for each chip. In such a manner, when available input/output (I/O) interfaces of a test device/test equipment are limited, the test efficiency of the test equipment is reduced, and the number of the chips that can be tested by the test equipment is also reduced.
FIG. 1 is a schematic diagram of a control manner for tested chips in the related art. In the solution shown in FIG. 1, one chip selection signal line (i.e., CS) controls one row or column of tested chips, and one set of physical signal line (i.e., L) controls one column or row of tested chips. The physical signal line includes a control signal line, an address signal line, and a data signal line. However, in such a control manner, the limited pins can be used to implement simultaneous write on multiple tested chips successfully, but the simultaneous read on the multiple tested chips cannot be implemented.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention, and together with the specification, serve to explain the principles of the present invention. Apparently, the accompanying drawings in the following description are only a portion of embodiments of the present invention, and those of ordinary skill in the art can derive other drawings from the accompanying drawings without creative efforts.
FIG. 1 is a schematic diagram of a multi-chip test system in the related art.
FIG. 2A and FIG. 2B are diagrams of a chip test system in an embodiment of the present invention.
The embodiments of the present invention will be described more completely in conjunction with the accompanying drawings. However, the embodiments can be implemented in various forms, and should not be considered as limitation to the embodiments described herein. Instead, these embodiments are provided to thoroughly and completely describe the present invention, and to fully convey the concepts of the embodiments for those skilled in the art. The described characteristics, structures, or properties may be combined in one or more embodiments in any manners. In the following description, details are provided for fully understanding the embodiments of the present invention. However, it would be obvious to those skilled in the art that one or more of the particular details may be omitted in the practice of the technical solutions of the present invention, or other methods, components, apparatuses, steps, and the like may be adopted. In other cases, the known technical solutions are not illustrated or described in detail to prevent distracting and obscuring the aspects of the present invention.
Additionally, the accompanying drawings include schematic diagrams of the present invention. The identical reference symbols in the drawings represent identical or similar parts, and therefore, the repeated descriptions thereof are omitted. Some block diagrams in the accompanying drawings are functional entities, which do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in a software form, or implemented in one or more hardware modules or integrated circuits, or in different networks, and/or processor apparatuses and/or microcontroller apparatuses.
The embodiments of the present invention are described below in detail with reference to the accompanying drawings.