Probing apparatus

#This non-provisional application claims priority under 35 U.S.C. § 119(a) to Patent Application No. 108121160 in Taiwan, R.O.C. on Jun. 18, 2019, the entire contents of which are hereby incorporated by reference.

#The instant disclosure relates to semiconductor testing equipment.

#Along with to the popularization of electronic products, electronic products mostly rely on a printed circuit board to integrate various electronic components to provide various functions. In the production process of the printed circuit boards, external factors may cause electrical defects such as short circuits, open circuits, and leakage. Therefore, the inspection of the printed circuit boards has always been an important part of the manufacturing process.

#The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus not limitative of the disclosure, wherein:

#FIG. 1 illustrates a schematic view of a probing apparatus according to a first embodiment of the instant disclosure, in which the rotatable testing platform of the probing apparatus is in a horizontal position;

#FIG. 2 illustrates a schematic view of the probing apparatus of the first embodiment, in which the rotatable testing platform is in a standing position;

#Please refer to FIG. 1. FIG. 1 illustrates a schematic view of a probing apparatus according to a first embodiment of the instant disclosure. The probing apparatus shown in the FIG. 1 comprises a frame 10, a testing device 20, a rotatable testing platform 30, and a probe module 34. The testing device 20 is disposed on the frame 10 and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform 30 is disposed on the frame 10 and is rotatable around a rotation axis O extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform 30 and the testing device 20 are located at different positions of the Z direction. The probe module 34 is disposed on the rotatable testing platform 30. It is worth noting that the X direction, Y direction, and Z direction described below are based on the coordinate system shown in FIG. 1.

#Based on this, referring to FIG. 1 and FIG. 2 together, the rotatable testing platform 30 can clamp the to-be-tested object D, and the double-sided test can be performed when the rotatable testing platform 30 rotates to a standing state. Moreover, the testing device 20 is located at a place having a shortest distance from the to-be-tested object D to the testing device 20, thereby being able to meet the configuration of the test signal lines for certain frequency testing. In one embodiment, the probing apparatus of the instant disclosure may be, but not limited to, applied to the 110 GHz high-frequency measurement.

#In one embodiment, referring to FIGS. 1 to 3, the frame 10 has opposite upper side 11 and lower side 12. In this embodiment, the upper side 11 of the frame 10 is provides with first guide rails 111 that extend in the X direction. Specially, in this embodiment, the upper side 11 of the frame 10 is provided with two first guide rails 111, and the two first guide rails 111 are spaced with and parallel to each other.