Testing device, testing system, and testing method

#The present disclosure relates to a testing device, a testing system, and a testing method, and to a testing device, a testing system, and a testing method used to test a wireless module using a non-contact technique.

#A wireless module (e.g., an mmWave RF wireless module) may be tested over the air (OTA). Such testing may be performed in a testing room (or a testing chamber), in which a plurality of absorbers are disposed (e.g. on inner surfaces thereof). Such a testing room (or testing chamber) can be large. For example, a size thereof may be 6 meters (m)*6 m*6 m, or 60 centimeters (cm)*60 cm*60 cm. In addition, such testing may take a long time. Therefore, such testing may be unsuitable for testing devices as part of a mass production process.

#According to one aspect, in some embodiments, a testing device includes a testing socket and a reflector. The testing socket defines an accommodating space. The reflector is disposed in the accommodating space and has a plurality of reflection surfaces non-parallel with each other. The reflection surfaces define a transmission space.

#Aspects of some embodiments of the present disclosure are readily understood from the following detailed description when read with the accompanying figures. It is noted that various structures may not be drawn to scale, and dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion.

#FIG. 1 illustrates a cross-sectional view of a testing device according to some embodiments of the present disclosure.

#FIG. 2 illustrates a top view of the testing device shown in FIG. 1.

#Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. Embodiments of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

#The following disclosure provides for many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description provided herein may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples provided herein. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

#In a comparative testing process, a DUT may have a first surface and a second surface opposite to the first surface. The DUT may include a plurality of solder bumps and an antenna. The solder bumps may be disposed on the first surface, and the antenna may be disposed on the second surface. During the testing process, a testing fixture picks up the DUT from the second surface of the DUT. Thus, a hard material (e.g. a metal material) of the testing fixture may contact the antenna on the second surface. Thus, the efficiency of the antenna may be negatively influenced (e.g. via deformation of the antenna).