High voltage assembly and detector
AssigneeNeusoft Medical Systems Co., Ltd.
InventorsShuangxue Li, Xin Xiang, Xiaoqing Hu, Songbo Yang
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AssigneeNeusoft Medical Systems Co., Ltd.
InventorsShuangxue Li, Xin Xiang, Xiaoqing Hu, Songbo Yang
Estimating the term…
High voltage assemblies and detectors are provided. In one aspect, a high voltage assembly includes a high voltage base board and a plurality of sub-detectors. Each sub-detector includes a crystal substrate, a crystal, a high voltage transfer board, and a high voltage cathode board. One of the high voltage transfer board and the high voltage base board includes first and second connection members, and the other one includes first and second contact members. The first connection member is configured to shift relative to the first contact member in response to a first force, and the second connection member is configured to shift relative to the second contact member in response to a second force. A high voltage is applied at both ends of the crystal through electrically contacting the first connection member with the first contact member and electrically contacting the second connection member with the second contact member.
A high voltage assembly, comprising:
A detector, comprising:
Dependencies are inferred from the claim text.
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Arrangements for measuring currents or voltages or for indicating presence or sign thereof: characterised by a specific application or detail not…
Computed tomography [CT]: transmission computed tomography [CT]
Characterised by using a particular type of detector: using matrix detectors
Characterised by using a particular type of detector: using energy resolving detectors, e.g. photon counting
About 14 years 10 months of term left · ends 9 Sep 2041 (estimated)
This application claims priority to Chinese Patent Application No. 202010066015.3 entitled “HIGH VOLTAGE ASSEMBLY AND DETECTOR” filed on Jan. 20, 2020, the entire content of which is incorporated herein by reference.
The present disclosure relates to medical device technology, and in particular to high voltage assemblies and detectors.
A photon-counting multi-spectral CT (Computed Tomography) detector includes a plurality of sub-detectors with energy direct transfer materials (such as crystalline semiconductors). For such a crystalline semiconductor detector, a pair of thousand volts of bias high voltages needs to be applied to upper and lower sides of the crystal to form a stable strong electric field in the crystal. However, wiring for thousand volts of high voltages is very difficult, which brings challenges to system design.
FIG. 1 is a perspective view of a structure obtained by assembling a high voltage assembly and a cradle according to an embodiment of the present disclosure, and only a part of the cradle is shown to clearly show a structure of the high voltage assembly.
FIG. 2 is an exploded schematic diagram of the sub-detector shown in FIG. 1.
FIG. 3 is a schematic diagram of a structure obtained by assembling a plurality of sub-detectors shown in FIG. 2.
FIGS. 1 to 4 illustrate a detector according to one or more embodiments of the present disclosure. The detector includes a cradle 1 and a high voltage assembly 2 fixed to the cradle 1.
The high voltage assembly 2 includes a high voltage base board 20 and a plurality of sub-detectors 21 in electrical contact with the high voltage base board 20. The high voltage base board 20 is fixed to the cradle 1. The plurality of sub-detectors 21 have the same structure. The high voltage base board 20 includes a first contact member 201 and a second contact member 202. The first contact member 201 is a cathode and the second contact member 202 is an anode, or the first contact member 201 is an anode and the second contact member 202 is a cathode. The sub-detector 21 includes a first connection member 210 electrically coupled to the first contact member 201 and a second connection member 211 electrically coupled to the second contact member 202. In some embodiments, the first contact member 201 and the second contact member 202 are electrically conductive pads. In some other embodiments, the first contact member 201 and the second contact member 202 may be any other electrically conductive components.
The sub-detector 21 and the high voltage base board 20 can be elastically coupled through the first connection member 210 and the second connection member 211. For example, the first connection member 210 and/or the second connection member 211 includes elastically deformable elastic terminals or Pogo Pin terminals. The detector includes the plurality of sub-detectors 21, and ideally, the gaps between every two adjacent sub-detectors 21 should be consistent. However, due to machining errors, the position of the sub-detector 21, especially the Z-direction position, can be fine-tuned during the installation process, so as to ensure that the gaps between any two adjacent sub-detectors 21 are consistent. In embodiments of the present disclosure, the sub-detector 21 of the high voltage assembly 2 and the high voltage base board 20 can be elastically contacted by the first connection member 210 and the second connection member 211, so as to conveniently adjust the position of the sub-detector 21 and effectively ensure the relative consistency of the positions of the plurality of sub-detectors 21.