Sensor arrangement for measurement of the temperature of a pane, in particular a windscreen

#The invention relates to a sensor arrangement for measurement of the temperature of a pane, wherein the sensor arrangement comprises a circuit carrier with a temperature sensor arranged thereon, wherein the circuit carrier and the temperature sensor are arranged in a housing and an electrical connection and a heat-conducting element are guided out of the housing.

#Generic sensor arrangements are known from DE 10 2010 026 563 A1 and DE 10 2006 060 548 A1. There a flexible printed circuit board is guided out of the housing and brought in contact with a windscreen. A temperature sensor is arranged directly on the printed circuit board, by means of which the temperature of the windscreen can be determined.

#Another sensor arrangement with a flexible heat-conducting element is known from DE 10 2005 038 466 B4.

#The invention is explained in further detail hereinafter with reference to an exemplary embodiment shown in the drawings. In detail in the schematic diagrams:

#FIG. 1: shows a schematic view of a sensor arrangement according to the invention;

#FIG. 2: shows a perspective view of a sensor arrangement according to the invention with a view of the connection of the electrical contact to a plug housing.

#FIG. 1 shows a schematic view of a sensor arrangement 1 according to the invention. A circuit carrier 2, which is typically a printed circuit board, is accommodated in a housing 4. The circuit carrier 2 has a plurality of metal layers 7, 8 and insulation layers located in between. The housing 4 is adjacent to a pane 10, in particular a windscreen. An electrical connection 5 and a heat-conducting element, which is here configured as a rigid pin 6, are guided out from the housing 4. The rigid pin 6 forms a thermal contact 11 with the pane 10. The rigid pin 6 is pressed into the housing 4, which in particular is a plastic housing, and in the printed circuit board 2 preferably a suitably prepared metallized bore 15 is provided into which the rigid pin 6 is pressed so that an electrical and thermal contacting of the rigid pin 6 to the various layers 7, 8 of the circuit carrier 2 is made. The layer 8, which faces away from the pane 10 and which also faces away from a temperature sensor 3 arranged on the circuit carrier 2 or is further removed from this is configured as a thermal guide plate 9. The thermal guide plate 9 is a layer of the circuit carrier 2 which is configured to be thickened and/or has few interruptions, so that a particularly good thermal conductivity is achieved. As a result, the temperature recorded via the pin 6 is transported into the region of the temperature sensor 3 and the temperature sensor 3 can particularly rapidly and precisely detect the temperature of the pane 10. In addition, an electrically insulating but thermally conductive mass can also be introduced here by means of which the temperature sensor 3 is connected to the thermal guide plate 9. Furthermore a sensor for measuring the internal moisture 12 is provided on the housing 4 which is also electrically contacted via the first layer 7 of the circuit carrier 2. The sensor element 3 is also electrically connected to the first layer 7 of the circuit carrier and is controlled via this. This can comprise a two-pole temperature measuring element or a three-pole temperature measuring element wherein a connection is then a separate thermal connection.

#FIG. 2 shows a complete arrangement with an outer housing 17 which accommodates the sensor arrangement 1 with the circuit carrier 2. The rigid pin 6 is here connected to a surface element 13 which is in contact with the pane 10 on the outer side of the outer housing 17. As a result a particular good thermal contact is possible. The surface element 13 is part of the electrical connection 5 which extends into a plug housing 18 of the outer housing 17. The electrical connection via the rigid pin 6 to the circuit carrier 2 is made there at the same time via this electrical connection 5.

#All the features mentioned in the preceding description and in the claims can be combined in any selection with the features of the independent claim. The disclosure of the invention is thus not restricted to the described or claimed feature combinations, on the contrary all the logical feature combinations within the framework of the invention should be considered to be disclosed.