Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component

A pre-assembly arrangement for a sensor component, the pre-assembly arrangement comprises:

• a printed circuit board having:
• a first printed circuit board region, and
• a second printed circuit board region, the first printed circuit board region is delimited from the second printed circuit board region by a milled groove;
• a sensor arranged in the first printed circuit board region;
• and
• a clamping device holding the sensor to the first printed circuit board region, such that the clamping device exerts a clamping force both on the sensor arranged on a first side of the first printed circuit board region, and on a second side of the first printed circuit board region.

A method for producing a sensor component, the method comprising:

• providing a printed circuit board having a first printed circuit board region and a second printed circuit board region, wherein the first printed circuit board region is delimited from the second printed circuit board region by a milled groove;
• arranging a sensor in the first printed circuit board region;
• pre-fixing the sensor on the first printed circuit board region by a clamping device, the clamping device engaging around the first printed circuit board region, such that the clamping device exerts a clamping force both on the sensor arranged on a first side of the first printed circuit board region, and on a second side of the first printed circuit board region;
• inserting the printed circuit board into an injection-molding tool, wherein a predefined angle between the first printed circuit board region and the second printed circuit board region is predefined during the inserting;
• and
• encapsulating the printed circuit board with a plastic by injection molding.