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US 11,535,952 B2Granted
Wafer carrier and method
AssigneeInfineon Technologies Americas Corp.
InventorsMihir Tungare, Peter Kim, Jianwei Wan, Chankyung Choi
Life of this patent
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Abstract
A wafer carrier includes a pocket sized and shaped to accommodate a wafer, the pocket having a base and a substantially circular perimeter, and a removable orientation marker, the removable orientation marker comprising an outer surface and an inner surface, the outer surface having an arcuate form sized and shaped to mate with the substantially circular perimeter of the pocket, and the inner surface comprising a flat face, wherein the removable orientation marker further comprises a notch at a first end of the flat face.
Claims13
A method, comprising:
- placing a wafer in a wafer carrier comprising a pocket sized and shaped to accommodate a wafer, the pocket being defined by a base and a substantially circular peripheral wall comprising an inner face and an outer face, wherein a notch in the inner face of the substantially circular peripheral wall provides a localised increased gap between the inner face and a side face of the wafer, the wafer carrier having a predetermined direction of rotation about an axis positioned perpendicular to an upper surface of the base of the pocket;
- rotating the wafer carrier in the predetermined direction of rotation;
- and
- epitaxially depositing a semiconductor layer on the wafer while rotating the wafer carrier in the predetermined direction of rotation,
- wherein the notch comprises a base having a first radius r1, a first lip transitioning between the substantially circular perimeter and the base of the notch and having a second radius r2, and a second lip transitioning between the substantially circular perimeter and the base of the notch and having a third radius r3,
- wherein a center point of the first radius r1 lies radially inwardly of the inner face and center points of the second and third radii r2 and r3 lies radially outwardly of the inner face such that the notch has an s-shaped contour.
3 more elements
A method, comprising:
- placing a wafer in a wafer carrier comprising a pocket sized and shaped to accommodate a wafer, the pocket being defined by a base and a substantially circular peripheral wall comprising an inner face and an outer face, wherein a notch in the inner face of the substantially circular peripheral wall provides a localised increased gap between the inner face and a side face of the wafer, the wafer carrier having a predetermined direction of rotation about an axis positioned perpendicular to an upper surface of the base of the pocket;
- rotating the wafer carrier in the predetermined direction of rotation;
- and
- epitaxially depositing a semiconductor layer on the wafer while rotating the wafer carrier in the predetermined direction of rotation,
- wherein the inner face includes a flat face and an arcuate face,
- wherein the notch is arranged at a transition between the flat face and the arcuate face of the inner face,
- wherein the notch comprises a base having a first radius r1, a first lip transitioning between the substantially circular perimeter and the base of the notch and having a second radius r2, and a second lip transitioning between the substantially circular perimeter and the base of the notch and having a third radius r3,
- wherein a center point of the first radius r1 lies radially inwardly of the inner face and center points of the second and third radii r2 and r3 lies radially outwardly of the inner face such that the notch has an s-shaped contour.
5 more elements
Dependencies are inferred from the claim text.