Electro-plating and apparatus for performing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Yuan Kao, Hung-Wen Su, Minghsing Tsai
Life of this patent
Estimating the term…
Abstract
A method of plating a metal layer on a work piece includes exposing a surface of the work piece to a plating solution, and supplying a first voltage at a negative end of a power supply source to an edge portion of the work piece. A second voltage is supplied to an inner portion of the work piece, wherein the inner portion is closer to a center of the work piece than the edge portion. A positive end of the power supply source is connected to a metal plate, wherein the metal plate and the work piece are spaced apart from each other by, and are in contact with, the plating solution.
Claims20
An apparatus for plating on a wafer, the apparatus comprising:
- a work piece holder configured to hold the wafer, the work piece holder comprising a retractable electrode, wherein the retractable electrode comprises:
- an outer shell;
- a first electrical contact comprising a first portion extending into the outer shell and a second portion extending out of the outer shell, wherein the first electrical contact is configured to be in physical contact with the wafer;
- and
- a seal ring encircling the second portion of the first electrical contact, wherein the seal ring is formed of a flexible material, and wherein the seal ring and the first electrical contact are configured to move relative to the outer shell;
- and
- a first power supply source electrically connecting to the first electrical contact, wherein the first power supply source is configured to supply a first voltage.
An apparatus for plating on a wafer, the apparatus comprising:
- a work piece holder configured to fix the wafer thereon, the work piece holder comprising:
- a blade configured to rotate along with the wafer, wherein the blade comprises a major slant surface neither perpendicular to nor parallel to a major surface of the wafer;
- a retractable electrode connecting to a center of the blade;
- and
- a conductive line comprising:
- a first portion embedded in the blade;
- and
- a second portion embedded in the retractable electrode;
- and
- a power source electrically connecting to the conductive line.
An apparatus for plating on a wafer, the apparatus comprising:
- a work piece holder configured to fix the wafer thereon, the work piece holder comprising:
- a cylinder comprising a seal ring;
- an outer shell having a portion of the cylinder therein, wherein a length of a part of the cylinder out of the outer shell is adjustable;
- a blade connected to the outer shell, wherein the blade comprises:
- a vertical surface perpendicular to a major surface of the wafer;
- and
- a major slant surface neither perpendicular to nor parallel to the vertical surface;
- and
- a conductive line comprising:
- a first portion penetrating through the seal ring;
- a second portion in the outer shell;
- and
- a third portion embedded in the blade;
- and
- a voltage supply source connecting to the conductive line.
Dependencies are inferred from the claim text.