Substrate holder and plating apparatus

A substrate holder for holding a substrate, comprising:

• a first holding member;
• a second holding member configured such that the substrate is sandwiched between the first holding member and the second holding member;
• a sealing member that forms a sealed space inside the substrate holder;
• a pin fixed to the second holding member;
• a ring disposed on the first holding member, the ring engaging with the pin;
• and
• a moving mechanism that circumferentially moves the ring, wherein
• the pin and the ring are engaged with one another to fix the first holding member and the second holding member to one another,
• the pin and the ring are disposed inside the sealed space,
• the first holding member has an outer contact portion electrically connected to an external power supply,
• the ring is electrically connected to the outer contact portion,
• the second holding member has contacts configured to supply current to the substrate,
• the pin is electrically connected to the contacts,
• the contacts are electrically connected to the outer contact portion by the pin,
• the current flows to the contacts in contact with the substrate when the pin engages with the ring,
• the contacts are not electrically connected to the outer contact portion when the pin is not engaged with the ring,
• the moving mechanism includes a plurality of teeth, and the plurality of teeth are formed on an outer peripheral edge portion of the ring along a circumferential direction, and
• the substrate holder includes an inner passage from outside the substrate holder to the plurality of teeth.