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US 11,535,945 B2Granted
Immersion plating treatments for indium passivation
AssigneeTexas Instruments Incorporated
InventorsSimon Joshua Jacobs, Kathryn Anne Schuck
Life of this patent
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Abstract
A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.
Claims20
A bonding structure formed on a substrate, the bonding structure comprising:
- a noble metal layer on the substrate;
- an indium layer having a first surface, a second surface opposite the first surface, and side surfaces, the first surface of the indium layer on the noble metal layer;
- and
- a nickel plating on the second surface and the side surfaces of the indium layer.
1 more element
A microelectronic device package comprising:
- a first substrate;
- a second substrate;
- and
- a bond layer between the first substrate and the second substrate, the bond layer around a cavity, the bond layer comprising:
- a noble metal layer on the first substrate;
- an indium layer on the noble metal layer;
- and
- a nickel plating on the indium layer.
5 more elements
A microelectronic device package comprising:
- a substrate;
- a noble metal layer on the substrate;
- an indium layer on the noble metal layer;
- and
- a nickel plating on the indium layer.
2 more elements
Dependencies are inferred from the claim text.