Sputtering apparatus and method of fabricating magnetic memory device using the same

A sputtering apparatus, comprising:

• a chamber;
• a chuck in a lower portion of the chamber and loads a substrate;
• a cooling unit connected to a lower portion of the chuck, the cooling unit configured to cool the chuck to a temperature less than room temperature;
• a gas supply configured to supply the chamber with a first inert gas and a second inert gas, the first inert gas and the second inert gas having a first evaporation point and a second evaporation point different from the first evaporation point, respectively;
• and
• a plurality of sputter guns above the chuck and in an upper portion of the chamber,
• wherein the sputter guns include,
• a first sputter gun on one side of the chuck, and
• a second sputter gun on another side of the chuck, the second sputter gun having a nozzle hole connected to the gas supply and configured to spray the second inert gas.