Latent reactive adhesive film
AssigneeTesa SE
InventorsMarco Kupsky, Thilo Dollase, Matthias Koop, Philipp Preuss
Life of this patent
Estimating the term…
Abstract
The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.
Claims20
A latently reactive adhesive composition consisting of:
- one or more polymers and at least one peroxide,
- wherein, the one or more polymers comprises at least 50% by weight of a polyurethane lacking C═C multiple bonds,
- wherein the at least one peroxide has the general structural formula R—O—O—R′ where R and R′ each represent organyl groups or collectively represent a cyclic organyl group, and
- wherein the polyurethane of the adhesive composition melts and crosslinks upon thermal activation.
A latently reactive adhesive composition consisting of:
- one or more polymers, at least one peroxide, and at least one adhesion promoter,
- wherein, the one or more polymers comprises at least 50% by weight of a polyurethane lacking C═C multiple bonds,
- wherein the at least one peroxide has the general structural formula R—O—O—R′ where R and R′ each represent organyl groups or collectively represent a cyclic organyl group, and
- wherein the polyurethane of the adhesive composition melts and crosslinks upon thermal activation.
Dependencies are inferred from the claim text.