Solvent free vinyl plastisol composition
AssigneeHenkel AG & Co. KGaA
InventorsDavid Sturgill, Corina Bisog, Joshua Harju
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AssigneeHenkel AG & Co. KGaA
InventorsDavid Sturgill, Corina Bisog, Joshua Harju
Estimating the term…
Disclosed is a heat curable solvent free plastisol composition that exhibits very low volatile organic compound amounts while maintaining high performance characteristics. The present plastisol compositions have solvent substitutes used at amounts up to 15% by weight based on the total composition weight. The solvent substitutes have very low vapor pressures, stable viscosity effects, and are fusible with the plastisol polymers. These solvent substitutes can be used to replace the typical solvents without requiring extensive re-formulation of the plastisol composition. The final plastisol compositions according to the present invention exhibit low VOC measures of less than 0.03 pounds per gallon when measured according to EPA Method 24.
A heat curable, sprayable plastisol composition having a low VOC content, consisting of:
A sprayable, heat curable plastisol composition, consisting of:
Dependencies are inferred from the claim text.